SMT POGO PIN
Spring Loaded Pogo Pin, test pin, contact probe and receptacle are developed especially for testing electrical requirements in a veriety of applications. They provide a reliable means to test in bare or loaded printed circuit boards and other circuitries where a number of contact points must be accessed.
- Head Style: Concave, Convex, Flat, Spear Point, Serrated, Star, Spherical Radius
- Diameter of Barrel: 0.68mm, 1.01mm, 1.37mm, 2.02mm, 2.36mm
- Spring Pressure: 80g, 100g, 150g, 200g, 250g
- Reference: Pogo Pin connector, Test Probe, Contact Probe, pin connector, cnc machining pogo pin and probe
Brief Introduction of SMT POGO Pin :
Pogo Pin is spring loaded probe which is made by precision instruments with riveting workmanship. It usually consists of plunger, tube and spring. Pogo pin is generally applied in the precision connection inside the electronics products such as mobile phones, communication devices, automotive, medical devices, aerospace devices and so on. Since pogo pin is very fine probe, it can make the finished connector light in weight, small in size and exquisite in look when it’s applied in a precision connector.
Features of SMT POGO PIN:
- Ball strucutre to protect spring from high current.
- Thru-hole tail for secure soldering.
- Solder-cup tail for wire attachment. (Recommended AWG19 or greater)
- Available 2A per pin
- Working Height: 2.5mm ~ 8.3mm
- Spring Force: 0.9N or 1.08N
- Tube Bottom Diameter: 1.8mm ~ 2.5mm
Structural Features of SMT POGO PIN
With ball structure: The ball inside allows more buffer, so result in a even more reliable connection.
Bias structure: The biased tail of the plunger creates a lateral force, so further improves the contact.
Back drill structure: The back drilled plunger increases the space for the spring, so allows a shorter pogo pin for tight space.
- Pogo Pin is to realise the connection between Board to Board
- Pogo pin usually has vertical connection and right angle connection
- Pogo pin is also to realise the connection between cable and device
Pogo pin Materials
| Parts | Materials | Surface treatment | Hazardous substances | Remarks |
| Plunger | C3604 | Ni1.4u~3.75u Au 0.4u | Lead is less than 4%, RoHS compliants | Forming Process C3604 for Lathe Tuming Maching |
| Tube | C3604 | Ni 1.4i~3.5u Au 0.1u | Lead is less than 4%, RoHS compliants | |
| Spring | SUS304 | N/A | | |
| Housing | PA46 LCP HPPA | N/A | Halogen free material | fire-protection rating UL94V-0 |
| Cap | PA46 HPPA | N/A | Halogen free material | fire-protection rating UL94V-0 |
Comparison of different structure of SMT POGO Pin
| Structure | Contact Impedance | Space saving | Amperage carrying | Reliability |
| A, With ball structure | ★★★★★ | ★★★☆☆ | ★★★★★ | ★★★★★ |
| B, Bias structure | ★★★★★ | ★★★★★ | ★★★★★ | ★★★★☆ |
| C, Back drill structure | ★★☆☆☆ | ★★★★★ | ★★☆☆☆ | ★★☆☆☆ |
Basic Specifications of SMT POGO Pin:
| ITEM | PERFORMANCE | NOTE |
| Rated voltage | Less than 36 Volte Dc | |
| Rated current | 2.0 Amperes | continuous per pin |
| Working temperature | -40 °C to 85 °C | |
| Storage temperature | -40 °C to 85 °C | |
| Woring environment humidity | 10% R.H. to 90% R.H. | |
| Durability | static testing 500,000 cycles,
dynamic testing 10,000 cycles | life cycle |
| Contact impedance | 30m ohm Max. | the contac impeance should be lower than 30m ohm during the whole working stroke,so it's dynamic contact impedance, not contact impedance in a certain point |
| PIN interval impedance | 500M ohm Min. | pogo pin connector |
| ITEM | Performance | Note |
| Rated Current | 2A | - |
| Rated Voltage | AC/DC 12V | - |
| Contact Resistance | 50mΩmax (stillness)
(At factory shipment) | 100mΩ after 100 times operation
(After Durability test at
Yokowo Regulation) |
| Insulation Resistance | 100MΩ (Min) | DC500V |
| Withstand Voltage | AC500V 1Min | Leak Current 3mA |
| Ambient Temp. | -40℃~+85℃ | - |
| Pin Force | 9.8N on a Pin from any direction | - |
| Pin Holding Strength | 4.9N on a Pin from axis direction | - |
| Cycle Durability | 20,000 times | Working Height |
| Temp./Humidity Cycle Test | Fig. 1 | JIS C60068-2-38 |
| Mechanical Shock Durability | 490m/s² | JIS C60068-2-27 |
| Soldering Temp. | 350℃ 3sec | Soldering Iron |
| Reflow Temp. | Fig.2 | - |
Basic Dimensions of SMT POGO Pin:
| ∅ A | B | C | D | E | FORCE(GF) | PART NUMBER |
| 1.20 | 0.60 | 1.45 | 1.95 | 1.60 | 35gf Min | 20101011233 |
| 2.00 | 0.40 | 2.20 | 3.00 | 2.40 | 90 Min | 101245-1 |
| 1.80 | 0.50 | 2.30 | 3.00 | 2.50 | 90 Min | 10101011363 |
| 1.65 | 0.40 | 2.20 | 3.00 | 2.50 | 90 Min | 101089-1 |
| 1.65 | 0.40 | 2.20 | 3.00 | 2.50 | 90 Min | 101603-1 |
| 1.65 | 0.60 | 2.40 | 3.20 | 2.70 | 90 Min | 101022-1 |
| 1.80 | 0.40 | 2.50 | 3.30 | 2.80 | 90±20 | 101080-1 |
| 2.00 | 0.40 | 2.50 | 3.30 | 2.80 | 90±20 | 101121-1 |
| 2.00 | 0.40 | 2.50 | 3.50 | 2.80 | 100±35 | 101281-1 |
| 2.00 | 0.40 | 2.50 | 3.50 | 2.90 | 100±30 | 101009-1 |
SMT POGO Pin
| Type | Working
Height | Spring
Force | Rated
Current | A | B | C | D | E | F |
| 2307 | 2.5 | 0.9N | 2A | 2.3 | 0.7 | 2.5 | 0.5 | 1.8 | 2.4 |
| 2509 | 2.8 | 0.9N | 2A | 2.5 | 0.9 | 2.8 | 0.6 | 1.8 | 2.4 |
| 2809 | 3.1 | 1.08N | 2A | 2.8 | 0.9 | 3.1 | 0.6 | 1.8 | 2.4 |
| 2910 | 3.2 | 1.08N | 2A | 2.9 | 1.0 | 3.2 | 0.7 | 1.8 | 2.4 |
| 3111 | 3.4 | 1.08N | 2A | 3.1 | 1.1 | 3.4 | 0.8 | 1.8 | 2.4 |
| 3212 | 3.5 | 1.08N | 2A | 3.2 | 1.2 | 3.5 | 0.9 | 1.8 | 2.4 |
| 3413 | 3.8 | 1.08N | 2A | 3.4 | 1.3 | 3.8 | 0.9 | 2.0 | 2.6 |
| 3614 | 4.0 | 1.08N | 2A | 3.6 | 1.4 | 4.0 | 1.0 | 2.0 | 2.6 |
| 3915 | 4.4 | 1.08N | 2A | 3.9 | 1.5 | 4.4 | 1.0 | 2.0 | 2.6 |
| 4215 | 4.7 | 1.08N | 2A | 4.2 | 1.5 | 4.7 | 1.0 | 2.5 | 3.1 |
| 4617 | 5.2 | 1.08N | 2A | 4.6 | 1.7 | 5.2 | 1.1 | 2.5 | 3.1 |
| 5117 | 5.7 | 1.08N | 2A | 5.1 | 1.7 | 5.7 | 1.1 | 2.5 | 3.1 |
| 5517 | 6.1 | 1.08N | 2A | 5.5 | 1.7 | 6.1 | 1.1 | 2.5 | 3.1 |
| 5920 | 6.6 | 1.08N | 2A | 5.9 | 2.0 | 6.6 | 1.3 | 2.5 | 3.1 |
| 6220 | 6.9 | 1.08N | 2A | 6.2 | 2.0 | 6.9 | 1.3 | 2.5 | 3.1 |
| 6520 | 7.2 | 1.08N | 2A | 6.5 | 2.0 | 7.2 | 1.3 | 2.5 | 3.1 |
| 7025 | 7.8 | 1.08N |
Product Tags:
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Dip Spring Loaded Pcb Test Pins 30m Ohm Max Contact Impedance Multiple Applications Images
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